Hybrid material with carbon wrapped around PET resin rod for electronic devices.
Enhancing the heat dissipation of electronic devices with the flexibility of resin and the rigidity of carbon.
In the field of electronic devices, efficient heat dissipation resulting from increased performance is considered crucial for the stable operation and longevity of products. Particularly in devices that are becoming smaller, designing for heat dissipation in limited spaces can pose challenges. Our hybrid material, which consists of a PET resin rod wrapped in carbon, enables parts design that takes heat dissipation into account by combining the workability of the resin core material with the properties of carbon. 【Application Scenarios】 - Heat dissipation components for electronic device enclosures - Cooling fan components - Thermal conduction path components 【Benefits of Implementation】 - Suppression of temperature rise inside the device - Improved reliability of components - Contribution to the miniaturization of products
- Company：株式会社がまかつ
- Price：Other
